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Surface conduction electron emission source enhanced by back gate electrode

机译:后栅电极增强的表面传导电子发射源

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Surface conduction electron emission device (SED) was fabricated with a back gate electrode. And then the device was electroformed in using continuous triangle wave at vacuum environment. After that we prepare an aluminum back electrode on the back of device. With the back electrode voltage changing, we could observe the change of the emission current. When device voltage and anode are fixed, the device's emission current and efficiency decrease under positive back voltage of 5V. On the contrary, the device's emission current and efficiency increase with negative back voltage of -5V. Our results directly proved that the emission electrons were from the field include cool electron emission, but not from the power induced thermal electron emission due to size-effect.
机译:用背栅电极制造表面传导电子发射装置(SED)。然后在真空环境下使用连续三角波进行电铸。之后,我们在装置背面准备铝背电极。随着后电极电压变化,我们可以观察发射电流的变化。当器件电压和阳极固定时,在5V的正背压下,器件的发射电流和效率降低。相反,该器件的发射电流和效率随着-5V的负背电压而增加。我们的结果总是证明了发射电子来自该领域包括酷电子发射,而不是由于尺寸效应引起的功率诱导的热电子发射。

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