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Effects of Substrate Temperature on Properties of Vanadium Oxide Thin Films on Si Substrate

机译:衬底温度对硅衬底上钒氧化物薄膜性能的影响

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We prepared the vanadium oxide thin films on Si substrates by magnetron sputtering , using different substrate temperatures, 300 °C ,350 °C ,400 °C. The effects of substrate temperature on film composition, micro morphology, resistance temperature characteristics, TCR (temperature coefficient of resistance) and other thin film characteristics were analyzed by XRD (X-Ray Diffraction), FESEM (Field emission scanning electron microscopy), and four-probe method. Results show that the increase of substrate temperature is conducive to the promotion of V_2O_5 (101) crystal formation in the films, meanwhile it is beneficial to reduce the gap and improve the uniformity of grain size, so as to increase the density of the films. The variation range of the film resistance was 500~1700 KΩ·cm,200~550 KΩ· cm and 30~160 YΩ· cm when the substrate temperature was 300°C,350°C and 400 °C. With the increase of substrate temperature, the room temperature resistance and high temperature resistance of the thin film are greatly reduced, and the TCR performance has been optimized at the same time. The room temperature TCR of the film is about -2.4%/°C under 400 °C substrate temperature, and the average TCR is about -1.98%/°C in the process of temperature change.
机译:我们通过磁控溅射在硅基板上制备氧化钒薄膜,使用不同的基板温度300°C,350°C和400°C。通过XRD(X射线衍射),FESEM(场发射扫描电子显微镜)分析了基板温度对薄膜成分,微观形貌,电阻温度特性,TCR(电阻温度系数)和其他薄膜特性的影响,并通过四项分析-探针方法。结果表明,衬底温度的升高有利于薄膜中V_2O_5(101)晶体的形成,同时有利于减小缝隙,提高晶粒尺寸的均匀性,从而提高薄膜的密度。当基板温度为300℃,350℃和400℃时,膜电阻的变化范围为500〜1700KΩ·cm,200〜550KΩ·cm和30〜160YΩ·cm。随着基板温度的升高,薄膜的耐室温性和耐高温性大大降低,并且同时优化了TCR性能。在400℃的基板温度下,膜的室温TCR为约-2.4%/℃,并且在温度变化过程中,平均TCR为约-1.98%/℃。

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