3D stacked dies structure is a promising architecture to realize small feature size and enhanced electronic performance. However, its thermal dissipating performance for high density integration has aroused extensive attention. In this paper, a 3D stacked structure for thermal behavior investigation is presented. The vertical temperature profile of the stacked structure is obtained. A thermal resistance network and a finite element model have been built to fit the experiment data. Thermal management for the 3D stacked structure also is studied by air force cooling and immersion de-ionized (DI) water cooling. A good agreement between models and experiments is observed, while the temperature difference between models and experiments is within 5%. Under the air force convection and immersion cooling, the highest temperature point to ambient thermal resistance of the 3D stacked structure decreases to 7.6°C/W and 1°C/W respectively.
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