The new 7th generation IGBT module with high compactness and high power density

摘要

Recently the main requirements found in the market are further downsizing and higher efficiency of power conversion systems. Enhanced power density of the power modules will be the key to succeed. The increasing package reliability in higher junction temperature operation will be the major challenge. By further improvement of the chip characteristics and the development of new high reliability package materials and technologies, the performance of the modules were significantly improved. Additionally, the maximum operating temperature was even increased to up to 175°C. The new 7th generation IGBT module realized further downsizing and higher efficiency of power conversion systems.