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Development of wet etch processing for InxAl1???xAsySb1???y solar cells grown on InP

机译:开发在InP上生长的InxAl1?xAsySb1?y太阳能电池的湿法刻蚀工艺

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Novel III-V multijunction solar cell concentrator devices grown on InP are potential candidates for achieving efficiencies under AM1.5D illumination of over 50%. Controlled fabrication of these structures involves a complete understanding of the interaction of different wet etch chemistries with the numerous combinations of alloys and semiconductor compounds in this material system. Selective etches for contact layer removal and non-selective etches for mesa isolation were studied for potential processing of an InAlAsSb device lattice-matched to InP. In addition to determining global etch rates for several materials grown on InP, two wet etch chemistries were analyzed in order to optimize a highly selective etch for effective lattice-matched InGaAs contact layer removal. We show that a citric acid-based solution etching of the InGaAs layer resulted in a lateral undercut that was five times greater than etching with a methylsuccinic acid-based solution.
机译:在InP上生长的新型III-V多结太阳能电池集中器设备是在AM1.5D照明下获得超过50%的效率时的潜在候选者。这些结构的受控制造涉及对不同湿法蚀刻化学与该材料系统中合金和半导体化合物的众多组合的相互作用的完整理解。研究了用于去除接触层的选择性刻蚀和用于台面隔离的非选择性刻蚀,以对与InP晶格匹配的InAlAsSb器件进行潜在处理。除了确定在InP上生长的几种材料的总体刻蚀速率外,还分析了两种湿法刻蚀化学,以优化高选择性刻蚀,以有效去除晶格匹配的InGaAs接触层。我们显示,InGaAs层的柠檬酸基溶液蚀刻导致的侧蚀比使用甲基琥珀酸基溶液蚀刻的侧蚀要大五倍。

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