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Camera interface method in mobile handset and its performance comparison

机译:相机接口方法在移动手机及其性能比较中

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As 3G became the general tendency of mobile industry, new mobile handsets are challenged to show more and more functions. In order to process high-resolution images, the high-speed data transfer technology that was originally used in communication system or server system started to be adopted in mobile handsets. It is the purpose of this paper to describe and compare some technologies for highspeed data transfer between camera and ISP(Image Signal Processor) focusing on specifications in the PHY layer, after going over the structural features of the mobile handsets. Most of these technologies are based on serial interface and they show excellence in terms of power, bandwidth and EMI in comparison to the conventional parallel interface based on the LVCMOS technology. In order to verify this fact, this paper presents a comparison of the SMIA interfaced camera module which represents the serial interface (as an example of the subLVDS technology) and the parallel interfaced camera module which represents the parallel interface (as an example of a general LVCMOS technology).
机译:由于3G成为移动行业的一般趋势,新的移动手机受到挑战,以显示越来越多的功能。为了处理高分辨率图像,最初用于通信系统或服务器系统的高速数据传输技术开始在移动手机中采用。本文的目的是描述和比较相机和ISP(图像信号处理器)之间的高速数据传输技术,其专注于PHY层中的规格,在移动手机的结构特征之后。这些技术中的大多数都是基于串行接口,与基于LVCMOS技术的传统并行接口相比,它们在电源,带宽和EMI方面展示了卓越。为了验证这一事实,本文提出了SMIA接口相机模块的比较,该相机模块代表串行接口(作为Sublvds技术的示例)和表示并行接口的并联接口相机模块(作为一般的示例LVCMOS技术)。

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