Laser chemical process for clean a

摘要

Cleaning applications in the semiconductor manufacturing industry are tougher to meet as the device dimensions decrease. The uniqueness of Oramir-Laser-Chemical process relies on the mutual combination and effectiveness of laser particle removal mechanisms and laser induced photon- thermal-chemical reaction in the mixture of O$-2$//O$- 3$//NF$-3$/ gases. The process involves ozone blast wave, photodecomposition of O$-3$/ into O radicals, photo-thermal decomposition of NF$-3$/ into fluorine radicals, thermal effects and thin liquid-chemical ablation enhanced particle removal. Recent results on Bare Si wafers, photomasks, EUV masks and scalpel masks show substantial removal efficiency, up to 100 percent for certain applications.