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Analysis of laser ablation process in semiconductor due to ultrashort-pulsed laser with molecular dynamics simulation

机译:用分子动力学模拟的超短脉冲激光引起的半导体激光烧蚀过程分析

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Rapid fusion and evaporation phenomena of silicon with ultrafast laser irradiation were simulated using the 3D molecular dynamics. Surface structure dependence of laser shock phenomena, fusion and evaporation process was examined for the Si(100) and Si(111) surface structures. It was shown that the crystal orientation influences the propagation velocity of shock wave and that heat conduction but laser absorption in the materials, that is, absorption coefficient affects the fusion depth when the pulse width is subpicosecond.
机译:利用3D分子动力学模拟具有超快激光照射的硅的快速融合和蒸发现象。检查Si(100)和Si(111)表面结构的激光休克现象,融合和蒸发过程的表面结构依赖性。结果表明,晶体取向会影响冲击波的传播速度,并且在材料中的激光吸收,即吸收系数在脉冲宽度是蛛网二秒的情况下影响融合深度。

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