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Investigation of electrical properties of contact between Molybdenum disulfide and different metals

机译:二硫化钼与不同金属接触的电学性质研究

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With growing interest in the application of molybdenum disulfide (MoS) into high performance transistors, understanding its contact with different metals is important. Improper MoS/metal contact render the device high contact impedance, which leads to insufficient charge injection efficiency and as a result, bad device performance. In this study, to characterize electrical properties in MoS/metal contact with commonly used metal: gold (Au), palladium (Pd), nickel (Ni) and titanium (Ti), Kelvin probe force microscopy (KPFM) is utilized to mapping the surface potential (SP) distribution in such contacts. It is concluded from the characterization results that band alignment between MoS and different metals are not determined solely by band structure of MoS and work function of the contact metals, instead, a special phenomenon--partial fermi level pinning appears in such contacts. Also, we notice that different metal processes considerable different topographical roughness, which may have great influence on the charge injection efficiency in the contacts.
机译:随着人们对将二硫化钼(MoS)应用于高性能晶体管的兴趣日益浓厚,了解其与不同金属的接触非常重要。 MoS /金属接触不当会导致设备具有较高的接触阻抗,这会导致电荷注入效率不足,从而导致设备性能下降。在这项研究中,为了表征MoS /金属与常用金属(金(Au),钯(Pd),镍(Ni)和钛(Ti))的接触时的电性能,利用开尔文探针力显微镜(KPFM)绘制了此类触点中的表面电势(SP)分布。从表征结果可以得出结论,MoS和不同金属之间的能带排列不仅仅取决于MoS的能带结构和接触金属的功函数,而是一种特殊的现象-这种接触中出现了部分费米能级钉扎。此外,我们注意到,不同的金属工艺会产生明显不同的形貌粗糙度,这可能会对触点中的电荷注入效率产生很大影响。

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