This paper conceives a flexible package based on 3D printing technology using liquid metal. This novel package utilizes integrated circuit process to fabricate the polydimethylsiloxane protection directly on the chips, then uses 3D printing technology to produce the wiring layer with liquid metal, and finally completes the package of integrate circuits with various functions and substrate materials. The authors focus on the process development of ultra-thin wafer grinding and 3D wiring printing on ultra-thin wafer, and investigate the feasibility of fabricating wiring layers by PVD and 3D printing. The authors consider that this new package based on 3D printing technology would make a great breakthrough in the near future.
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