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Distributed Intracortical Neural Interfacing: Network protocol design

机译:分布式皮层内神经接口:网络协议设计

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New high-performance neural interfacing approaches are demanded for today's Brain-Machine Interfaces (BMIs). In this paper, we present the architecture of a wireless network of implantable microsystems (Brain-ASNET: Brain Area Sensor NETwork). As well, we introduce an energy-efficient ad-hoc network protocol for the desired network, along with a method to overcome issue of variable packet length caused by bit stuffing process in HDLC standard protocol. To implement the idea, architecture and design of a System-on-a-Chip (SoC) is also presented. The SoC can be configured to be used either as a sensor node chip or the network coordinator's RF front-end and network controller. The SoC is designed and laid-out in an IBM 0.13μm CMOS process. The post-layout simulation results show energy efficiency of the designed ad-hoc network protocol and low power dissipation of the SoC. The whole chip, including all functional and peripheral integrated components, consumes 138μW and 412μW, at 1.2V, configured in a synchronized network as a sensor node and the coordinator, respectively.
机译:当今的脑机接口(BMI)需要新的高性能神经接口方法。在本文中,我们介绍了可植入微系统的无线网络(Brain-ASNET:脑区域传感器网络)的体系结构。同样,我们为所需的网络引入了一种节能的自组织网络协议,以及一种克服了HDLC标准协议中由位填充过程引起的可变数据包长度问题的方法。为了实现该思想,还介绍了片上系统(SoC)的体系结构和设计。可以将SoC配置为用作传感器节点芯片或网络协调器的RF前端和网络控制器。 SoC采用IBM0.13μmCMOS工艺进行设计和布局。布局后的仿真结果表明所设计的ad-hoc网络协议的能效和SoC的低功耗。整个芯片(包括所有功能和外围集成组件)在1.2V时消耗138μW和412μW,并在同步网络中分别配置为传感器节点和协调器。

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