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Fabrication of Resonator-Quantum Well Infrared Photodetector (R-QWIP) with 10.2 nm Cutoff

机译:截止波长为10.2 nm的共振器量子阱红外光电探测器(R-QWIP)的制造

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Recently, we have developed a new detector structure, which is known as the resonator-QWIP or R-QWIP. With the new structure, we demonstrated quantum efficiency (QE) as high as 70% in single detectors and 30 - 40% in focal plane arrays (FPAs) with 9 μm cutoff. In this study, we designed a broadband, 10 μm cutoff R-QWIP FPA using a more accurate refractive index. To achieve the theoretical prediction, the substrates of the detectors have to be removed completely to prevent the escape of unabsorbed light out of the detectors. The height of the diffractive elements (DE) and the thickness of the active resonator must also be uniformly produced within 0.05 μm accuracy. To achieve these specifications, two optimized inductively coupled plasma (ICP) etching processes are developed. Using these etching techniques, a number of single detectors were fabricated to verify the analysis before FPA production. In general, test data support the theoretical predictions.
机译:最近,我们开发了一种新的检测器结构,称为谐振器QWIP或R-QWIP。通过这种新结构,我们证明了具有9μm截止值的单个探测器的量子效率(QE)高达70%,焦平面阵列(FPA)的量子效率(QE)高达30-40%。在这项研究中,我们使用更准确的折射率设计了宽带,截止值为10μm的R-QWIP FPA。为了达到理论上的预测,必须完全去除检测器的基板,以防止未吸收的光逸出检测器。衍射元件(DE)的高度和有源谐振器的厚度也必须在0.05μm的精度内均匀产生。为了达到这些规格,开发了两种优化的电感耦合等离子体(ICP)蚀刻工艺。使用这些蚀刻技术,制造了许多单个检测器,以在FPA生产之前验证分析。通常,测试数据支持理论预测。

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