calibration; contact resistance; gold; micromachining; micromechanical devices; photoresists; soft lithography; sputter etching; three-dimensional integrated circuits; 2D pyramid patterns; 3D pyramid patterns; 3D structure construction; Au-Au; MEMS; RIE system; contact resistance testing evaluation; engineered lower contact surfaces; fixed-fixed beam; gray-scale lithography; hemispherical upper contact; initial testing; load calibration; lower planar contacts; microcontact support structure; microelectromechanical systems; micromachining; photoresist; resistance 0.7 ohm; resistance 1.083 ohm; trion reactive ion etch system; wafer etching; Contact resistance; Electrical resistance measurement; Gray-scale; Resists; Surface resistance; Three-dimensional displays;
机译:层序地层界表面的生物地理学评价:位于阿尔伯塔省塞伯的碳酸盐岩层(上白垩统;上土耳子-下柯尼阶)中的卡迪纳/莱兰不整合面(“ E5 / T5表面”)
机译:层序地层界表面的生物地理学评价:阿尔伯塔省塞贝的碳酸盐岩层(上白垩统;上土耳阶-下柯尼阶)中的卡迪纳/莱兰不整合面(“ E5 / T5表面”)
机译:以湿式摩擦离合器材料为例的粗糙表面微接触仿真
机译:带有上半球和下平面或工程表面的微触点的接触电阻评估
机译:工程欧姆触点III-V,III-N和2D二均甲基化物:退火和表面制剂对接触电阻的影响
机译:基于余弦曲线形凹凸的钢材磨削表面微接触刚度模型
机译:用湿摩擦离合器材料的例子模拟粗糙表面的微接触