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3D Integration and assembly of wireless sensor nodes for #x2018;green#x2019; sensor networks

机译:用于“绿色”传感器网络的3D集成和无线传感器节点的组装

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Integration and assembly of wireless sensor nodes within limited size and volume may not only reduce production cost, but also enable layout-free distribution of autonomous sensor nodes for environmental monitoring, energy consumption management, remote monitoring of civil infrastructure, as well as for biological and human health monitoring. Pursuit of the lowest power consumption of the wireless sensor nodes is another critical issue, which may allow us to use solar cell or other energy harvesting device as the power source, and then reduces the system installation difficulties and maintenance cost. Therefore, in this work, we have engaged in developing a practical applicable approach for flexible assembly of wireless sensor nodes with lowest possible size and lowest power consumption form both system block and physical interconnection points-of-view. A customized RF-transmitter IC (operation frequency: 315MHz) with universal interface to both digital sensors and analog sensors was developed to manage the power consumption of those sensors as well as to reduce the power consumption of data transmission. Buried bump interconnection technology (B2itTM) with internal cavities for bare die IC chips and passive components was introduced for 3D integration and assembly of MEMS sensors, customized RF-transmitter IC, crystal oscillator, resistors, capacitors and other passive components. One of the world smallest wireless sensor nodes, 3.9 mm (W)×3.9 mm (D)×3.5 mm (T) (except for power source and antenna), was demonstrated for humidity and temperature monitoring. Power consumption of above sensor nodes was evaluated and compared with our previous prototype, in which a commercial available RF-transmitter IC was integrated for data transmission. The developed approach in this work is believed practically valuable as platform technologies for mass production of wireless sensor nodes as well as for ubiquitous applications of those sensor nodes in w- reless sensor networks.
机译:在有限的尺寸和体积内集成和组装无线传感器节点,不仅可以降低生产成本,而且还可以实现无传感器布局的自主传感器节点的无布局分布,用于环境监测,能耗管理,民用基础设施的远程监测以及生物和生物人体健康监测。追求无线传感器节点的最低功耗是另一个关键问题,这可能使我们可以使用太阳能电池或其他能量收集设备作为电源,从而降低了系统安装难度和维护成本。因此,在这项工作中,我们致力于开发一种实用的方法,以最小的尺寸和最低的功耗从系统块和物理互连的角度灵活组装无线传感器节点。开发了一种定制的RF发送器IC(工作频率:315MHz),该IC具有与数字传感器和模拟传感器的通用接口,以管理这些传感器的功耗并降低数据传输的功耗。引入了具有用于裸芯片IC芯片和无源元件的内部空腔的埋线凸点互连技术(B2itTM),用于MEMS传感器,定制的RF发送器IC,晶体振荡器,电阻器,电容器和其他无源元件的3D集成和组装。演示了世界上最小的无线传感器节点之一,3.9毫米(W)×3.9毫米(D)×3.5毫米(T)(电源和天线除外)用于湿度和温度监控。对上述传感器节点的功耗进行了评估,并与我们之前的原型进行了比较,在原型中,集成了商用RF发送器IC进行数据传输。在这项工作中开发的方法被认为具有实用价值,可作为无线传感器节点的批量生产以及无线传感器网络中这些传感器节点的普遍应用的平台技术。

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