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Usage of low-temperature co-fired ceramic in hermetic packaging

机译:低温共烧陶瓷在密封包装中的使用

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This article deals with usage of low-temperature co-fired ceramic as a material for hermetic package of bare-dies. Two types of substrates are measured — Heraeus HeraLock2000 and DuPont GreenTape 951PT. For more accurate results, different arrays of vias are designed to imitate conductive joints in a package. An air-tightness of samples is determined based on Oxygen Transmission Rate measurement. Dependence of the air-tightness on a material thickness and on a count of vias was investigated. Design and fabrication of the samples and measurement description is also included. Results of this experiment compare mentioned types of ceramics and create a base of knowledge for design of an air-tight package.
机译:本文涉及使用低温共烧陶瓷作为裸露模具的气密包装材料。测量了两种类型的基材-Heraeus HeraLock2000和DuPont GreenTape 951PT。为了获得更准确的结果,设计了不同的通孔阵列以模仿封装中的导电接头。样品的气密性是根据氧气透过率测量值确定的。研究了气密性对材料厚度和通孔数量的依赖性。还包括样品的设计和制造以及测量说明。该实验的结果比较了提到的陶瓷类型,并为气密包装的设计奠定了知识基础。

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