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Topology Characteristics Analysis and Performance Comparison for Optimal Design of High Efficiency PFC Circuit for Telecom

机译:电信高效率PFC电路最优设计的拓扑特性分析与性能比较

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This paper is selecting typical PFC topology that can be application design of high-capability power of high efficiency, high power factor correction (PFC) performances, and review its operating characteristics, and analyze the actual performance differences to manufacture 2kwatt grade product under the same conditions. The first topology is average current mode control (ACM) PFC that the performance is excellent and applications examples are various in conventional PFC circuit methods. The second topology is related to Interleaved PFC of dual boost way that has the advantages of current ripple performance improvement and current stress reduction properties. Third and fourth topology is back to back bridgeless (BTBBL) PFC and semi-bridgeless (SBL), and the object of topologies is to improve loss of bridge diode. PSIM simulation was used for comparison of topology and prototype was designed with power density standard of more 1.35kW/dm~3 under 1U size low-profile conditions. To minimize the performance comparison errors, design conditions such as board space, heat-sink and PCB pattern synchronize to the maximum. It should be note that topology efficiency and power factor performance difference was identified objectively through comparing tests.
机译:本文正在选择典型的PFC拓扑,可以是高效率,高功率因数校正(PFC)性能的高能力功率的应用设计,并查看其操作特性,并分析了在相同的2KWATT等级产品的实际性能差异状况。第一个拓扑是平均电流模式控制(ACM)PFC,性能优异,应用示例在传统的PFC电路方法中是各种各样的。第二拓扑与双升压方式的交错PFC有关,其具有电流纹波性能提高和电流应力降低性能的优点。第三和第四个拓扑重新回到了无限的(BTBBL)PFC和半无桥(SBL),拓扑对象是提高桥梁二极管的损失。 PSIM仿真用于拓扑和原型的比较,设计了在1U尺寸低调条件下的1.35kw / dm〜3的功率密度标准。为了最大限度地减少性能比较误差,设计条件(如板空间,散热器和PCB模式)同步到最大值。应注意,通过比较测试,客观地确定了拓扑效率和功率因数性能差异。

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