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Topology characteristics analysis and performance comparison for optimal design of high efficiency PFC circuit for telecom

机译:电信高效PFC电路优化设计的拓扑特征分析和性能比较

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This paper is selecting typical PFC topology that can be application design of high-capability power of high efficiency, high power factor correction (PFC) performances, and review its operating characteristics, and analyze the actual performance differences to manufacture 2kwatt grade product under the same conditions. The first topology is average current mode control (ACM) PFC that the performance is excellent and applications examples are various in conventional PFC circuit methods. The second topology is related to Interleaved PFC of dual boost way that has the advantages of current ripple performance improvement and current stress reduction properties. Third and fourth topology is back to back bridgeless (BTBBL) PFC and semi-bridgeless (SBL), and the object of topologies is to improve loss of bridge diode. PSIM simulation was used for comparison of topology and prototype was designed with power density standard of more 1.35kW/dm3 under 1U size low-profile conditions. To minimize the performance comparison errors, design conditions such as board space, heat-sink and PCB pattern synchronize to the maximum. It should be note that topology efficiency and power factor performance difference was identified objectively through comparing tests.
机译:本文选择典型的PFC拓扑结构,该拓扑结构可以作为高效能,高功率因数校正(PFC)性能的应用设计,并回顾其工作特性,并分析实际性能差异,从而在相同的条件下制造2kW级产品情况。第一种拓扑是平均电流模式控制(ACM)PFC,它具有出色的性能,并且在常规PFC电路方法中的应用示例多种多样。第二种拓扑结构与双升压方式的交错式PFC有关,它具有改善电流纹波性能和降低电流应力特性的优点。第三和第四拓扑是背靠背无桥(BTBBL)PFC和半无桥(SBL),拓扑的目的是改善桥式二极管的损耗。使用PSIM仿真进行拓扑比较,并在1U尺寸低剖面条件下设计了功率密度标准为1.35kW / dm 3 的原型。为了最大程度地降低性能比较误差,电路板空间,散热器和PCB图案等设计条件要同步到最大。应该注意的是,通过比较测试客观地确定了拓扑效率和功率因数性能的差异。

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