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Failure analysis of CuCr contacts of Vacuum interrupter

机译:真空灭弧室CuCr触头故障分析

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The Copper-Chromium (CuCr) contact material is the most widely used material for the contacts of the vacuum interrupters (VI). Performance of the VI is greatly influenced by the properties of contact materials. During switching operations, such as short-circuit current interruption, a vacuum arc is generated which in turn produces melted and resolidified layers at the contact surface. Melting followed by welding of CuCr contact results the failure of Vacuum interrupter. This paper correlated the switching performance and the metallurgy of the contacts, specifically in cases where the contacts have welded. The paper reports important factors like microstructure, Cr distribution, conductivity, hardness etc. which significantly affect the welding performance of the contacts. The conductivity and hardness of the contacts were measured by using an eddy current based conductivity meter and Vickers hardness tester respectively. The failure of contacts because of welding has been discussed with respect to conductivity and distribution of Cr as seen in its microstructure. The contacts were also characterized by X-ray diffraction and scanning electron microscopy to correlate the data.
机译:铜铬(CuCr)接触材料是用于真空灭弧室(VI)触点的最广泛使用的材料。 VI的性能在很大程度上受到接触材料性能的影响。在诸如短路电流中断之类的开关操作期间,产生真空电弧,该真空电弧继而在接触表面上产生熔化和重新凝固的层。熔化后再焊接CuCr触点会导致真空灭弧室发生故障。本文将开关性能与触点的冶金性能相关联,特别是在触点已焊接的情况下。该论文报告了重要的因素,如微观结构,Cr分布,电导率,硬度等,这些因素显着影响触点的焊接性能。分别使用基于涡流的电导率仪和维氏硬度计测量触点的电导率和硬度。从焊接的微观结构来看,已经讨论了由于焊接而导致的触点失效,涉及到铬的导电性和分布。触点还通过X射线衍射和扫描电子显微镜进行表征,以使数据相关。

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