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Electro-thermal co-simulation of two parallel-connected SiC-MOSFETs under thermally-imbalanced conditions

机译:在热不平衡条件下的两个平行连接SiC-MOSFET的电热共模

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This paper describes electro-thermal co-simulation of two parallel-connected SiC-MOSFETs using a temperature-dependent compact model for a discrete SiC-MOSFET. The temperature-dependent compact model is constructed on the basis of the previous model with appropriate-modification of output characteristics and threshold voltage. This compact model also gives the accurate reproducibility of the transient waveforms in a high region of drain current. The current sharing simulation between the parallel-connected SiC-MOSFETs under thermally-imbalanced conditions is experimentally verified. Based on the above verification, the electro-thermal co-simulation in a boost chopper is conducted, which successfully shows the junction temperature distribution between the two SiC-MOSFETs.
机译:本文使用用于离散SiC-MOSFET的温度依赖性紧凑型模型,描述了两个平行连接的SiC-MOSFET的电热共模。温度依赖性紧凑型模型是在先前模型的基础上构造的,具有适当的输出特性和阈值电压。该紧凑型模型还提供了在漏极高区域中的瞬态波形的精确再现性。实验验证了在热不平衡条件下并联连接的SiC-MOSFET之间的电流共享模拟。基于上述验证,进行了升压斩波器中的电热共模,这成功地显示了两个SiC-MOSFET之间的结温分布。

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