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Methodology for Early RTL Testability and Coverage Analysis and Its Application to Industrial Designs

机译:早期RTL可测试性和覆盖率分析的方法论及其在工业设计中的应用

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Testability analysis in the RTL design cycle of an IP or SoC is a critical need for designers to minimize design iterations and resources, and to enable faster design closure times. A mandatory requirement for any such technique is its scalability and applicability to large and complex industrial designs. In this paper, we share an RTL testability analysis framework developed to address the above need. The framework consists of three main components: (i) A strong static design rules for testability checker that can audit an RTL circuit for DFT readiness from both stuck-at and transition fault testing perspectives, (ii) Coverage estimator that can provide early bounds for achievable coverage and help pinpoint design artifacts that limit coverage, and (iii) A random pattern based analysis engine to identify hard-to-test nodes that warrant further fixes. This framework has been commercially used by multiple customers. In collaboration with one of our customers, we share empirical data from applying this methodology to various IPs in a recently taped-out 45nm SoC.
机译:IP或SoC的RTL设计周期中的可测试性分析是设计人员最大限度地减少设计迭代和资源并缩短设计完成时间的关键需求。任何此类技术的强制性要求是其可扩展性和对大型复杂工业设计的适用性。在本文中,我们共享为满足上述需求而开发的RTL可测试性分析框架。该框架包括三个主要部分:(i)可测试性检查器的强大静态设计规则,可以从卡住和过渡故障测试的角度审核RTL电路的DFT准备情况;(ii)覆盖率估算器可以为可实现的覆盖范围,并帮助查明限制覆盖范围的设计工件,以及(iii)基于随机模式的分析引擎,以识别需要进一步修复的难以测试的节点。该框架已被多个客户商业使用。与我们的一位客户合作,我们分享了将这种方法应用于最近被淘汰的45nm SoC中的各种IP的经验数据。

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