Using Existing Reconfigurable Logic in 3D Die Stacks for Test

摘要

We propose an architecture for an FPGA-based tester for a 3D stacked IC. Our design exploits the underlying structure of the FPGA, allowing it to be used to efficiently store and apply predefined test patterns at a high bandwidth, reducing the FPGA resources required and often reducing scan shift toggling. The proposed approach and its advantages can generally also be applied to 2.5D multi-die circuits containing FPGAs.