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Compliance Current Effect on Switching Behavior of Hafnium Oxide based RRAM

机译:合规性电流对氧化铪基RRAM切换行为的影响

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In this study, we compared the basic switching behaviors of HfO_2, Al_2O_3 and HfAlOx (Hf:Al=9:1) based RRAM with Ti top electrode by setting various compliance currents (1mA, 5mA, 10mA, 15mA). The resistance ratio of HfO_2 based RRAM (20 → 320) increases with compliance current whereas it drops not obviously for Al_2O_3 based RRAM (85→54). HfAlOx (Hf:Al=9:1)) based one has the best resistance ratio (300-440) and resistance stability. All low resistance state (LRS) resistance values of three samples are around 100Ω with large compliance current while there is a difference in HRS resistance which causes the ratio difference accordingly. The dominant mechanism of resistive switching is the formation and rupture of the conductive filament composed of oxygen vacancies. The appropriate compliance current selection and doping technology to high-k materials should be considered in further study.
机译:在这项研究中,通过设定各种合规电流(1mA,5mA,10mA,15mA),比较了基于TI顶电极的RRAM的HFO_2,AL_2O_3和HFALOX(HF:Al = 9:1)的基本切换行为。基于HFO_2的RRAM(20→320)的电阻比随符合性电流的增加而增加,而基于AL_2O_3的RRAM(85→54)则下降。基于Hfalox(HF:Al = 9:1),其具有最佳的阻力比(300-440)和电阻稳定性。三个样品的所有低电阻状态(LRS)电阻值约为100Ω,符合性大小,而HRS电阻差异导致相应的比率差异。电阻切换的主要机理是由氧空位组成的导电灯丝的形成和破裂。在进一步的研究中,应考虑适当的合规电流选择和掺杂技术。

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