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Growth of hydrogenated microcrystalline silicon thin films using electron cyclotron resonance chemical deposition method

机译:电子回旋共振化学沉积法生长氢化微晶硅薄膜

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Hydrogenated microcrystalline silicon (μc-Si:H) thin films have been grown on glass substrates by electron cyclotron resonance chemical vapor deposition (ECR-CVD) at a low temperature of 180 °C. We investigate the influence of hydrogen dilution ratio (H2/SiH4) and working pressure on structural properties as deposition rate, crystallinity, and hydrogen content of the μc-Si:H. It is found that with increasing hydrogen dilution ratio and decreasing the working pressure, the deposition rate and the hydrogen content decrease, while the crystallinity increases. The phenomenon is attributed by the etching effect of hydrogen atoms, which will break the weak bonds to form an order structure. Furthermore, we have obtained high crystallinity under low hydrogen dilution ratio and low temperature. We have demonstrated that high-crystallinity μc-Si:H thin films can be grown under much lower hydrogen dilution ratio compared with conventional PECVD method by ECR-CVD due to the high plasma density.
机译:氢化微晶硅(μc-Si:H)薄膜已通过电子回旋共振化学气相沉积(ECR-CVD)在180°C的低温下生长在玻璃基板上。我们研究了氢稀释比(H2 / SiH4)和工作压力对结构性质的影响,如沉积速率,结晶度和μc-Si:H的氢含量。发现随着氢稀释比的增加和工作压力的降低,沉积速率和氢含量降低,而结晶度提高。该现象归因于氢原子的蚀刻作用,氢原子的蚀刻作用将破坏弱键以形成有序结构。此外,我们在低氢稀释率和低温下获得了高结晶度。我们已经证明,与传统的通过ECR-CVD进行的PECVD方法相比,由于高的等离子体密度,可以在低得多的氢稀释比下生长高结晶度的μc-Si:H薄膜。

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