aluminium; electron backscattering; electron diffraction; field emission electron microscopy; focused ion beam technology; grain size; metallic thin films; scanning electron microscopy; surface topography; vapour deposition; 111 orientation; Al; EBSD detector; FESEM; FIB; Si; electron backscattering diffraction technique; electron transparent TEM foil; field emission scanning electron microscope; flat surface; grain equivalent diameter; grain orientation; growth direction; high topography surface aluminum thin film; mean aluminum grain size; normal direction; physical vapour deposition; relative smooth surface; silicon substrate; size 0.317 mum; spatial resolution; submicron grain sizes; transmission EBSD; transmission Kikuchi diffraction; Aluminum; Diffraction; Grain size; Silicon; Substrates; Surface topography; Surface treatment;
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