We present a parameterized macromodeling approach to perform fast and effective dynamic thermal simulations of electronic components and systems where key design parameters vary. A decomposition of the frequency-domain data samples of the thermal impedance matrix is proposed to improve the accuracy of the model and reduce the number of the computationally costly thermal simulations needed to build the macromodel. The methodology is successfully applied to analyze the impact of layout variations on the dynamic thermal behavior of a state-of-the-art 8-finger AlGaN/GaN HEMT grown on a SiC substrate.
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机译:我们提出了一种参数化的宏建模方法,可以对关键设计参数发生变化的电子组件和系统执行快速有效的动态热仿真。提议对热阻矩阵的频域数据样本进行分解,以提高模型的准确性并减少构建宏模型所需的计算成本高昂的热仿真次数。该方法已成功应用于分析布局变化对生长在SiC衬底上的最新8指AlGaN / GaN HEMT的动态热行为的影响。
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