We present a parameterized macromodeling approach to perform fast and effective dynamic thermal simulations of electronic components and systems where key design parameters vary. A decomposition of the frequency-domain data samples of the thermal impedance matrix is proposed to improve the accuracy of the model and reduce the number of the computationally costly thermal simulations needed to build the macromodel. The methodology is successfully applied to analyze the impact of layout variations on the dynamic thermal behavior of a state-of-the-art 8-finger AlGaN/GaN HEMT grown on a SiC substrate.
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机译:我们介绍了一个参数化的宏观耦合方法,以执行键设计参数变化的电子元件和系统的快速有效的动态热模拟。提出了热阻抗矩阵的频域数据样本的分解,以提高模型的准确性,并减少构建Macromodel所需的计算昂贵的热模拟的数量。成功地应用了方法,以分析布局变化对在SiC基板上生长的最先进的8手指AlGaN / GaN HEMT的动态热行为的影响。
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