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Optimization of kinetic inductance detectors for millimeter and submillimeter wave detection

机译:优化用于毫米波和亚毫米波检测的动感检测器

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We present the latest improvements of lumped element kinetic inductance detectors (LEKIDs) for the NIKA camera at the 30-m telescope of IRAM at Pico Veleta (Spain). LEKIDs are direct absorption detectors for millimeter wavelength and represent a particularly efficient concept of planar array continuum detectors for the millimeter and submillimeter wavelength range. To improve the detector radiation coupling over a wider frequency range, a combination of backplane reflector and a supplementary layer of dielectric between silicon substrate and backplane has been successfully explored. To this end we apply deep silicon etching to the substrate in order to decrease its effective dielectric constant in an intermediate layer. In the first generation of LEKIDs array, the response is disturbed by the presence of slot-modes in the frequency multiplexing coplanar feed/readout line, an effect which was reduced when applying wire bonding across the readout line. Superconducting air-bridges can be integrated into the array fabrication process. The suppression of slot-modes also reduces undesired cross-talk between pixels. Our current KID detectors are made of very thin aluminum films, but with a thickness of less than 20 nm we have reached some limitations concerning the layout and material processing. Following the results from Leduc et al., we developed non-stoichiometric titanium nitride (TiN) at IRAM as an alternative material. We focus on the work done to achieve reproducible and homogenous films with the required transition temperature for mm-wave detection. We present characterization techniques that allow room temperature measurements to be correlated to the transition temperature of TiN_x and first measurements on a test sample.
机译:我们为位于皮科韦莱塔(西班牙)的IRAM的30米望远镜提供了用于NIKA相机的集总元件动感检测器(LEKID)的最新改进。 LEKID是毫米波波长的直接吸收检测器,代表了毫米波和亚毫米波波长范围的平面阵列连续谱检测器的特别有效的概念。为了在更宽的频率范围内改善探测器辐射耦合,已经成功地探索了底板反射器和硅基板与底板之间的电介质补充层的组合。为此,我们对基板进行深硅蚀刻,以降低其在中间层中的有效介电常数。在第一代LEKIDs阵列中,频率复用共面馈电/读出线中存在缝隙模式会干扰响应,当在读出线上进行引线键合时,这种效果会降低。超导气桥可以集成到阵列制造过程中。缝隙模式的抑制还减少了像素之间不希望的串扰。我们当前的KID检测器是由非常薄的铝膜制成的,但是厚度小于20 nm,在布局和材料处理方面存在一些限制。根据Leduc等人的结果,我们在IRAM上开发了非化学计量的氮化钛(TiN)作为替代材料。我们专注于完成具有毫米波检测所需的转变温度的可再现且均质薄膜的工作。我们介绍了表征技术,这些技术允许室温测量值与TiN_x的转变温度和测试样品的首次测量值相关。

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