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SRAM with c-axis aligned crystalline oxide semiconductor: Power leakage reduction technique for microprocessor caches

机译:具有c轴对齐晶体氧化物半导体的SRAM:微处理器高速缓存的功耗降低技术

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摘要

SRAM with backup circuits using a crystalline oxide semiconductor (OS) (e.g., a c-axis aligned crystalline oxide semiconductor (CAAC-OS) typified by CAAC In-Ga-Zn oxide (CAAC-IGZO)) is reported. Results of cell-level simulation based on 45-nm Si/100-nm OS process technology show backup time of 3.9 ns, recovery time of 2.0 ns, and break-even time of 21.7 ns. The OS-SRAM cell can replace a standard-SRAM cell without area overhead, which does not significantly affect normal operation. A 32-bit microprocessor test chip (350-nm Si/180-nm OS technology) with cache memory including the OS-SRAM was fabricated to demonstrate the intended normal and power-gating operations. The test chip demonstrated 97.6% standby power saving.
机译:报道了具有使用晶体氧化物半导体(OS)(例如,以CAAC In-Ga-Zn氧化物(CAAC-IGZO)为代表的c轴取向晶体氧化物半导体(CAAC-OS))的备用电路的SRAM。基于45纳米Si / 100纳米OS工艺技术的单元级仿真结果显示,备用时间为3.9 ns,恢复时间为2.0 ns,收支平衡时间为21.7 ns。 OS-SRAM单元可以取代标准SRAM单元,而不会占用面积,这不会显着影响正常操作。制造了具有包括OS-SRAM的高速缓存的32位微处理器测试芯片(350 nm Si / 180 nm OS技术),以演示预期的正常操作和电源门操作。测试芯片显示了97.6 的待机功耗节省。

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