We present a non-contact, on-wafer, broadband device and component testing methodology scalable to the THz band. The “contactless” probe setup is based on radiative coupling of vector network analyzer test ports onto the coplanar waveguide environment of monolithic devices and integrated circuits. Efficient power coupling is achieved via planar, broadband, antennas that act as the “virtual” probe-tips on the chip under test. For accurate S-parameter measurements, repeatable errors in the setup are calibrated. In this paper, we demonstrate for the first time experimental validation of the calibration of the new non-contact probes for the 325–500 GHz band (using WR 2.2 frequency extenders and a standard vector network analyzer as the backend). This non-contact probe setup is accurate, low-cost and is readily scalable down to the mmW band and up to the THz band (60GHz-3THz).
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