Experimental Investigation of Chip Seal Adhesion Performance with Modified Binder in Cold Climate

摘要

The purpose of this study is to evaluate chip seal performance with neat and polymer modifiedbitumen chip seals constructed with different aggregate combinations with emphasis on aggregateretention under in climate using Accelerated Chip Seal Simulation Device (HSKSC). The aggregateretention performances of neat bitumen versus modified were compared with three types of aggregates atlow temperatures. Major findings of this research include that polymer modification of neat bitumenimproved aggregate retention performance. In addition, the results showed that decrease in temperaturecauses an increase in aggregate loss.