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Highly Integrated MMIC Chipset for Ku-Band Satellite Transponder

机译:高度集成的KU波段卫星转发器芯片组

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This paper presents the architecture, design and measured results of high performance GaAs MMIC chipset for Ku-band satellite payload. Chipset is designed with the objective to achieve best performance with minimum number of highly integrated MMICs and minimum off-chip components. Chipset contains Low Noise Amplifier (LNA), Double Balanced resistive PHEMT mixer (DBM), Variable Gain Amplifier (VGA) and Amplifier with 4-bit digital attenuator. MMICs are realized using 0.2μm GaAs PHEMT process. Key features of these circuits are low noise, excellent gain flatness, LO harmonic rejection and good linearity with gain control. In design, special attention was given to unconditional stability and good matching. This makes all MMICs cascadable, which eliminates isolators in system design. These MMICs reduce complexity and cost of satellite onboard subsystems and provide an ultra miniature, three-chip all MMIC solution to satellite on board receiver design. The three-chip receiver achieves 55dB gain with 1.6dB Noise figure in 13.5GHz-15GHz frequency band. MMIC chips are designed for two standard packages with chip size 2.6mm × 1.6mm and 2.6mm × 2.0mm.
机译:本文介绍了KU波段卫星有效载荷的高性能GAAS MMIC芯片组的架构,设计和测量结果。芯片组是设计的目的,可以实现最佳的高度集成MMIC和最小片外组件的最佳性能。芯片组包含低噪声放大器(LNA),双平衡电阻PHEMT混频器(DBM),可变增益放大器(VGA)和带4位数字衰减器的放大器。 MMIC使用0.2μmGaAs Phemt工艺实现。这些电路的主要特征是噪音低,优异的增益平整度,谐振抑制和具有增益控制的良好线性。在设计方面,特别注意无条件稳定和良好的匹配。这使得所有MMICS级联,消除了系统设计中的隔离器。这些MMIC减少了卫星船上子系统的复杂性和成本,并为船上设计的卫星提供了超小型,三芯片所有MMIC解决方案。三芯片接收器在13.5GHz-15GHz频带中使用1.6dB噪声系数实现55dB增益。 MMIC芯片专为两个标准封装而设计,芯片尺寸为2.6mm×1.6mm和2.6mm×2.0mm。

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