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Damage prediction in graphene thermoplastics for potential electronic packaging applications

机译:石墨烯热塑性塑料损伤预测潜在电子包装应用

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Graphene is a promising material for electronics industry due to its unique mechanical and electronic properties. In this study, the failure analysis of the graphene sheets is performed by using Peridynamic theory due to its unique capability in failure prediction at the continuum level and the similarity of its mathematical structure to the molecular dynamic simulations (MDS). The current approach is validated against MDS predictions by considering zig-zag and armchair type single layer graphene sheets with an initial edge notch subjected to tension loading. Finally, a similar analysis is performed for multi-layered graphene layers which are either commensurate or incommensurate to investigate the effect of number of zigzag and armchair type graphene sheets and their stacking sequence on failure modes.
机译:由于其独特的机械和电子性质,石墨烯是电子行业的有希望的材料。 在该研究中,通过使用智能理论来进行石墨烯片的故障分析,由于其在连续水平的故障预测的独特能力以及其数学结构与分子动态模拟(MDS)的异常性的独特性。 通过考虑锯齿和扶手椅类型的单层石墨烯片来验证目前的方法,通过考虑具有张力负荷的初始边缘凹口的锯齿和扶手椅类型的单层石墨烯片。 最后,对多层石墨烯层进行类似的分析,该石墨烯层进行相称或不加密的,以研究Z字形和扶手椅型石墨烯片的效果及其堆叠序列对故障模式的影响。

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