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Effect of Prolonged Storage up to 1-year on the High Strain Rate Properties of SAC Leadfree Alloys at Operating Temperatures up to 200°C

机译:长期储存高达1年对囊状率高达200°C的高应变率特性的影响高达200°C

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Transient dynamic loads in addition to prolonged periods of high temperature exposure are a part of number of high profile applications with high reliability needs. Examples include - electronics in automotive applications may be mounted under the hood or in the trunk of the car resulting in prolonged periods of high temperature exposure followed by operation under vibration while at environmental temperature extremes, and electronics in downhole drilling applications may be mounted close to the drill tip resulting in exposure to transient dynamic loads. High strain rates encountered subsequent to prolonged periods of non-operational high temperature storage encountered in downhole drilling, and automotive underhood applications require the development of computational tools and techniques for prediction of material deformation behavior and reliability. In this study, mechanical properties of lead free SAC105 and SAC305 has been measured for strain rates 1-100 per sec at elevated temperature 200C after prolonged storage for periods up to 1-year. Stress-Strain curves have been plotted over a wide range of strain rates and temperatures for pristine specimen which have been fabricated using reflow profiles representative of solder-joint production assemblies. The fabricated SAC105 and SAC305 leadfree alloys specimen have been tested at strain rates of 10, 35, 50 and 75 per sec at various operating temperatures of 50°C, 75°C, 100°C, 125°C, 150°C, 175°C, and 200°C. Experimental data for the aged specimen has been fit to the ANAND's viscoplastic model.
机译:瞬态动态载荷除了长时间的高温暴露之外还具有高可靠性需求的高型材应用数量的一部分。实例包括 - 汽车应用中的电子器件可以安装在罩下方或在汽车的躯干中,导致长时间的高温暴露,然后在环境温度下进行操作,在环境温度极端时,井下钻孔应用中的电子设备可以接近地安装钻头尖端导致曝光到瞬态动态负载。在井下钻井中遇到的长时间的非操作高温储存之后遇到的高应变率,以及汽车底层应用需要开发用于预测材料变形行为和可靠性的计算工具和技术。在该研究中,在延长储存期间,在高达1年的时间后,每秒的升高温度为1-100℃,每秒的菌株1-100的菌株率为1-100的力学性能。已经绘制了应力 - 应变曲线在广泛的应变速率和温度上绘制了原始标本的温度,这些标本是使用代表焊接 - 联合生产组件的回流型材制造的。在50℃,75℃,100℃,125℃,150℃,175的各种操作温度下,在每秒10,35,50和75的菌株速率下测试制造的SAC105和SAC305引出合金标本。 °C,和200°C。老化样本的实验数据适合Aand的粘性模型。

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