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Selective charge injection induced microstructural modifications in hydrogenated nanocrystalline silicon: A current-sensing atomic force microscopy study

机译:选择性电荷注入在氢化纳米晶硅中引起的微观结构修饰:电流感应原子力显微镜研究

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Hydrogenated nanocrystalline silicon (nc-Si:H) films prepared by RF sputtering were studied by current sensing atomic force microscope (CSAFM) using conductive cantilevers. The tip of CSAFM was used to inject charges into the selective areas of the film at positive and negative 10 V bias. The changes in the topography and electrical conductivity of these regions were measured using contact-mode atomic force microscopy (AFM) and CSAFM. Significant changes in the surface topography and electrical conductivity were observed with charge injection. The average height of the charge injected area increased over non-injected surface, and the increase in the surface height was proportional to imaging duration. Topographical features at smaller scale, such as heights of individual grains, decreased with imaging. The changes in the topographical features are independent of bias polarity. The charge injection resulted in a large drop in local electrical conductivity, with over 95 % decrease in injected current after 36 minutes of injection. It is speculated that high energy (10 eV) charge injection resulted in breaking of local chemical bonds, increasing local free volume and creating additional mid-gap defect states. The changes in topography and electrical conductivity are attributed to these changes respectively.
机译:利用导电悬臂,通过电流传感原子力显微镜(CSAFM)研究了通过射频溅射制备的氢化纳米晶硅(nc-Si:H)薄膜。 CSAFM的尖端用于在正负10 V偏压下将电荷注入薄膜的选择性区域。使用接触模式原子力显微镜(AFM)和CSAFM测量了这些区域的形貌和电导率变化。通过电荷注入观察到表面形貌和电导率的显着变化。电荷注入区域的平均高度在未注入的表面上增加,并且表面高度的增加与成像持续时间成比例。较小的地形特征(例如单个晶粒的高度)随成像而降低。地形特征的变化与偏置极性无关。电荷注入导致局部电导率大幅下降,注入36分钟后注入电流下降超过95%。据推测,高能(10 eV)电荷注入会导致局部化学键断裂,增加局部自由体积并产生其他中间间隙缺陷状态。形貌和电导率的变化分别归因于这些变化。

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