The Effect of the Ground Plane Incorporated into Layers on Multilayer CBCPW Lines, Lumped Elements and Circuit for a Compact MCM

摘要

This paper investigates the effect of embedding the ground plane of conductor-backed CPW lines and lumped elements in the lower layers of a multilayer substrate. This is of interest for realizing more compact multilayer MCMs. Dropping the ground plane to lower layers increases the circuit density and at the same time improves the performance of CPW lines and lumped elements. The practical effect of dropping the ground plane down into the lower layers is investigated for a 3GHz low pass filter.