90 Degree Tandem Hybrid with Tolerance to Displacement Error and Thickness Variation in Multi-layered Substrate

摘要

90 degree coupled-line hybrid that is tolerant to manufacturing errors in a multi-layered substrate has been developed. The tolerance to displacement error and thickness variation in the multi-layered substrate can be achieved by using diagonally shifted coupled lines with adjacent ground walls. It has been demonstrated that the coupling characteristics of the hybrids fabricated in LTCC agree well with designed ones and their deviation is very small.