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Impact of on-Silicon De-Embedding Test Structures and RF Probes Design in the Sub-THz Range

机译:硅脱嵌的测试结构的影响和RF探头设计在亚周范围内

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In this paper, we present on-wafer TRL calibration results up to 220 GHz using on-wafer fabricated test structures on the silicon substrate. For on-wafer TRL calibration, “Open-M1”, which is an important test structure used for transistor's de-embedding, is considered as a DUT and thorough analysis is presented about its terminal capacitances. The measurement results are comprehensively examined through 3D EM simulation and possible solutions to improve on-wafer TRL calibrated measurement results are also proposed.
机译:在本文中,我们在硅衬底上使用晶片制造的测试结构呈现晶片TRL校准结果,最高可达220 GHz。对于晶圆TRL校准,“Open-M1”是用于晶体管去嵌入的重要测试结构,被认为是DUT,并彻底分析了其终端电容。通过3D EM模拟综合检查测量结果,还提出了改进晶圆TRL校准测量结果的可能解决方案。

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