A novel compact microstrip-to-waveguide transition structure for integration with multilayered circuits

摘要

A novel compact microstrip-to-waveguide transition is presented. In this structure, the backshort is surrounded by metal vias and integrated with a multilayered circuit board. The bottom of the backshort is formed by an array of metal blind vias with periodic structure. An air blind via array is drilled into the substrate within the backshort. Therefore the cross-section dimensions of the backshort are recalculated. A model is designed and simulated at 60 GHz using HFSS, and the simulation results validate the effectiveness of this compact microstrip-to-waveguide transition structure.