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Influence of the organic vehicle and inorganic additives on the properties of thick film pastes for AlN

机译:有机载体和无机添加剂对AlN厚膜浆料性能的影响

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New conductor pastes for AlN as substrate material with fired films of a sheet resistance below25 mOhm/sq were investigated. The pastes consist of AgPd as conductive phase for leach resistance. Otherpaste ingredients are glasses of matched composition for adhesion and densification properties, littleamounts of inorganic additives and organic vehicles for film deposition. The latter has a significantinfluence on the paste deposition and the resulting film properties as well. In order to shine light into theserelationship systematic rheological studies of the organic vehicle and the manufactured pastes wereperformed. The rheological investigations include measurements in rheological steady-state as well asdynamic experiments. In addition, the solder properties of the fired film were studied. FESEM analyseswere performed on the surface of the fired films.
机译:用于AlN的新型导体浆料,作为基材材料,其表面电阻低于15微米的烧结膜 研究了25 mOhm / sq。糊剂由AgPd组成,作为导电相,具有抗浸出性。其他 糊状成分是具有匹配组成的玻璃,具有附着力和致密性,几乎没有 用于薄膜沉积的无机添加剂和有机载体的量。后者具有重大意义 对糊剂沉积和所得膜性质的影响也是如此。为了将光线照进这些 有机载体和制成的糊剂的系统流变学研究之间的关系 执行。流变学研究包括流变稳态的测量以及 动态实验。另外,研究了烧成膜的焊接性能。 FESEM分析 在烧制薄膜的表面上进行。

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