Thick film paste, inorganic powder composition for thick film paste, ceramic wiring board and manufacturing method thereof, and semiconductor device

摘要

PROBLEM TO BE SOLVED: To decrease a void produced in a conductor forming a surface layer and an inside layer, an insulating material, a dielectric and a resistor part, and in a ceramic part in their vicinity. ;SOLUTION: A total content of an element (chromium, iron, cobalt, nickel) oxide of which functions as oxidizing catalyst for carbon is set for not more than 400 wt.ppm to a total of thick film 1. A green sheet 2 is formed by using the thick film paste (insulating paste), and after a through hole 11 for connecting between layers is formed in it, screen printing of an internal wiring conductor 12 and a surface conductor layer 13 is applied on the green sheet by using the thick film paste (conductive paste) (a). After plural pieces of printed sheets 3 are positioned, laminated and thermocompression-bonded (b), their binder is removed and they are baked by heating (at 900° for 5 hours, for example) in a lightly oxidizing atmosphere (atmosphere in which copper is not oxidized and organic material such as binder and the like is removed by oxidization (c). Multi-layer wiring board of ceramic 4 can be obtained by the above process (d).;COPYRIGHT: (C)1999,JPO