Fabrication and measurements of an individually addressable micro-probe electrode array using silicon through-glass via

摘要

In this study, a micro-probe electrode array with independent interconnections through the substrate has been developed using LRS(Low Resistance Silicon) via and glass reflow process. The silicon vias have electrical resistance less than 2 Ω because the boron ion in the borosilicate glass wafer can diffuse into the LRS pillars during glass reflow process. The LRS wafer was etched with double DRIE (Deep Reactive Ion Etching) and RIE (Reactive Ion Etching) process to form 70 μm-height and 190 μm-pitch silicon micro-probe structures. To connect to silicon via, Cr/Au was deposited and patterned on micro-probe array structures. The Parylene-C film was deposited and patterned for insulating layer. To verify electrochemical characteristics of individually addressable micro-probe electrode array, the CV (Cyclic Voltammetry) measurement method was performed.