Here we present the design and implementation of electrical and mechanical interfaces for fluidically-assembled planar MEMS. We discuss the design and fabrication of systems of passive mechanical latches to bond microcomponents together and of electrical layers capable of establishing electrical connections with each other. We evaluate the ability of components with these interfaces to bond together within a microfluidic channel and to establish electrical circuits when assembled. This work supports the development of a novel microassembly strategy that bridges the gap between bottom-up self-assembly and top-down direct-manipulation technique. The ultimate goal of this research is the development of MEMS devices capable of the on-demand self-assembly, repair, and reconfiguration.
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