首页> 外文会议>European Photovoltaic Solar Energy Conference and Exhibition >INVESTIGATION OF THERMAL STABILITY AND INTERNAL FIXED-CHARGE STATE FOR FIELD EFFECT PASSIVATION LAYER OF STRONTIUM SILICATE ON SILICON SUBSTRATE
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INVESTIGATION OF THERMAL STABILITY AND INTERNAL FIXED-CHARGE STATE FOR FIELD EFFECT PASSIVATION LAYER OF STRONTIUM SILICATE ON SILICON SUBSTRATE

机译:硅酸盐上硅酸锶场致钝化层的热稳定性和内部固定电荷状态的研究

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Strontium silicate (SrSiOx) is one of candidates to be a field effect passivation layer with positivefixed-charges (FCs). In this study, we provide systematic investigations of thermal stability and internal FC state forSrSiOx layer grown on crystalline silicon (c-Si) substrate. The SrSiOx layers were fabricated by growing SrO layerson Si substrates using pulsed laser deposition, and then post-annealing treatment (PAT) in oxygen atmosphere. Toinvestigate the thermal stability of the samples, the PAT was carried out at various temperatures from 500~800°C.From x-ray photoemission spectroscopy measurements, we identified that the SrSiOx/Si structure was maintainedafter the PAT below 700°C, but SiOx layer began to grow at the interface above 800°C. The internal FC state wasevaluated by capacitance-voltage (C-V) measurements for samples having various thickness of SrSiOx layer.Negative flat band voltage shift (NFBVS) was observed in the SrSiOx/Si samples annealed at 600 °C. In the sampleswith a longer PAT above 2 hours, the effective FC density estimated from the magnitude of the NFBVS was almostconstant (~1×1012 cm-2) against the thickness variation. From these results, we consider that the origins of theNFBVS would be likely due to intrinsic positive FC existing in the vicinity of the SrSiOx/Si interface. For theinterface FC, it is independence from the SrSiOx thickness, and we can freely design FEP layer thickness withoutconstraint. This would provide the degree of freedom in the cell design including anti-refection layers.
机译:硅酸锶(SrSiOx)是具有正场效应的钝化层的候选之一 固定费用(FC)。在这项研究中,我们提供了系统的热稳定性和内部FC状态的系统研究。 在晶体硅(c-Si)衬底上生长的SrSiOx层。通过生长SrO层来制造SrSiOx层 使用脉冲激光沉积法在Si衬底上沉积金属,然后在氧气气氛中进行后退火处理(PAT)。到 为了研究样品的热稳定性,PAT在500〜800°C的不同温度下进行。 通过X射线光电子能谱测量,我们确定SrSiOx / Si结构得以保持 在低于700°C的PAT后,SiOx层开始在高于800°C的界面处生长。内部FC状态为 通过电容电压(C-V)测量对具有不同厚度的SrSiOx层的样品进行评估。 在600°C退火的SrSiOx / Si样品中观察到负平带电压偏移(NFBVS)。在样品中 在2小时以上的PAT较长的情况下,根据NFBVS的大小估算的有效FC密度几乎为 常数(〜1×1012 cm-2)随厚度变化而变化。根据这些结果,我们认为 NFBVS可能是由于SrSiOx / Si界面附近存在固有的正FC。为了 界面FC,它与SrSiOx厚度无关,我们可以自由设计FEP层厚度而无需 约束。这将在包括抗复制层的细胞设计中提供自由度。

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