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PREDICTION OF WIRE WEAR, WIRE BOW AND WAFER TOTAL THICKNESS VARIATION IN THE DIAMOND WIRE WAFERING PROCESS

机译：金刚石线加工过程中线磨损，线弓和晶片总厚度变化的预测

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《European Photovoltaic Solar Energy Conference and Exhibition》|2013年|1|共1页
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K. Sunder; H. Uhle; S. Knöppel; O. Anspach;
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3. Prediction of the thickness for silicon wafers sawn by diamond wire saw [J] . Liu Tengyun, Ge Peiqi, Bi Wenbo, Materials science in semiconductor processing . 2017,第期

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4. PREDICTION OF WIRE WEAR, WIRE BOW AND WAFER TOTAL THICKNESS VARIATION IN THE DIAMOND WIRE WAFERING PROCESS [C] . K. Sunder, H. Uhle, S. Knöppel, European Photovoltaic Solar Energy Conference and Exhibition . 2013

机译：金刚石线加工过程中线磨损，线弓和晶片总厚度变化的预测
5. An investigation of wire electrical discharge machining (WEDM) of p-doped elemental semiconductors for wafer slicing and high-aspect-ratio microfabrication. [D] . Rakwal, Dinesh. 2009

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6. The Influence of Wire Speed on Phase Transitions and Residual Stress in Single Crystal Silicon Wafers Sawn by Resin Bonded Diamond Wire Saw [O] . Tengyun Liu, Peiqi Ge, Wenbo Bi 2021

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7. Determination of the impact of the wire velocity on the surface damage of diamond wire sawn silicon wafers [O] . Würzner Sindy, Falke Annemarie, Buchwald Rajko, 2015

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