首页> 外文会议>IEEE Conference on Electrical Performance of Electronic Packaging and Systems >Design and verification of SMT MMIC package using a 20 GHz LNA, a 40 GHz LNA and a 40GHz digital attenuator
【24h】

Design and verification of SMT MMIC package using a 20 GHz LNA, a 40 GHz LNA and a 40GHz digital attenuator

机译:使用20 GHz LNA,40 GHz LNA和40GHz数字衰减器的SMT MMIC包的设计与验证

获取原文

摘要

A surface mounting (SMT) low temperature cofired ceramic (LTCC) MMIC package was developed using new vertical transition consist of a trough line, a slab line, and shielded multilayer coplanar waveguides (SMCPWs) for DC to 50 GHz band applications. A 20 GHz LNA, a 40 GHz LNA and a 40 GHz 5-bit digital attenuator were packaged to verify the performances of the developed LTCC SMT MMIC package. The packaged 20 GHz LNA has less than 0.3 dB gain degradation, compared with the on-wafer measurement. The packaged 40 GHz LNA has some differences with on-wafer measurement due to the size mismatch with the MMIC package. The packaged 40 GHz attenuator exhibits a negligible degradation of the attenuation accuracy, compared to the on-wafer results.
机译:使用新的垂直过渡开发了表面安装(SMT)低温COfired陶瓷(LTCC)MMIC封装,该垂直过渡包括用于DC至50 GHz频带应用的槽线,板条线和屏蔽多层共面波导(SMCPW)。包装20GHz LNA,40 GHz LNA和40 GHz 5位数字衰减器以验证开发LTCC SMT MMIC包装的性能。与晶片上的测量相比,包装的20GHz LNA具有小于0.3dB的增益降解。包装的40GHz LNA由于MMIC封装的尺寸不匹配而导致晶圆测量有一些差异。与晶圆片结果相比,封装的40GHz衰减器表现出可忽略的衰减精度劣化。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号