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Design and verification of SMT MMIC package using a 20 GHz LNA, a 40 GHz LNA and a 40GHz digital attenuator

机译:使用20 GHz LNA,40 GHz LNA和40GHz数字衰减器的SMT MMIC封装的设计和验证

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A surface mounting (SMT) low temperature cofired ceramic (LTCC) MMIC package was developed using new vertical transition consist of a trough line, a slab line, and shielded multilayer coplanar waveguides (SMCPWs) for DC to 50 GHz band applications. A 20 GHz LNA, a 40 GHz LNA and a 40 GHz 5-bit digital attenuator were packaged to verify the performances of the developed LTCC SMT MMIC package. The packaged 20 GHz LNA has less than 0.3 dB gain degradation, compared with the on-wafer measurement. The packaged 40 GHz LNA has some differences with on-wafer measurement due to the size mismatch with the MMIC package. The packaged 40 GHz attenuator exhibits a negligible degradation of the attenuation accuracy, compared to the on-wafer results.
机译:使用新的垂直过渡层开发了一种表面安装(SMT)低温共烧陶瓷(LTCC)MMIC封装,该新的垂直过渡包括一个槽线,一个平板线和一个屏蔽多层共面波导(SMCPW),适用于DC至50 GHz频带的应用。封装了20 GHz LNA,40 GHz LNA和40 GHz 5位数字衰减器,以验证开发的LTCC SMT MMIC封装的性能。与晶圆上测量相比,封装的20 GHz LNA的增益衰减小于0.3 dB。封装的40 GHz LNA由于与MMIC封装的尺寸不匹配,在晶圆上测量方面存在一些差异。与晶圆上的结果相比,封装的40 GHz衰减器的衰减精度几乎可以忽略不计。

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