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Tiered-latency DRAM: A low latency and low cost DRAM architecture

机译:分层延迟DRAM:低延迟和低成本DRAM架构

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The capacity and cost-per-bit of DRAM have historically scaled to satisfy the needs of increasingly large and complex computer systems. However, DRAM latency has remained almost constant, making memory latency the performance bottleneck in today's systems. We observe that the high access latency is not intrinsic to DRAM, but a trade-off made to decrease cost-per-bit. To mitigate the high area overhead of DRAM sensing structures, commodity DRAMs connect many DRAM cells to each sense-amplifier through a wire called a bitline. These bitlines have a high parasitic capacitance due to their long length, and this bitline capacitance is the dominant source of DRAM latency. Specialized low-latency DRAMs use shorter bitlines with fewer cells, but have a higher cost-per-bit due to greater sense-amplifier area overhead. In this work, we introduce Tiered-Latency DRAM (TL-DRAM), which achieves both low latency and low cost-per-bit. In TL-DRAM, each long bitline is split into two shorter segments by an isolation transistor, allowing one segment to be accessed with the latency of a short-bitline DRAM without incurring high cost-per-bit. We propose mechanisms that use the low-latency segment as a hardware-managed or software-managed cache. Evaluations show that our proposed mechanisms improve both performance and energy-efficiency for both single-core and multi-programmed workloads.
机译:DRAM的容量和每位成本在历史上一直在扩展,以满足日益庞大和复杂的计算机系统的需求。但是,DRAM延迟几乎保持恒定,这使内存延迟成为当今系统中的性能瓶颈。我们观察到,高访问延迟不是DRAM固有的,而是要权衡以降低每位成本。为了减轻DRAM感应结构的高面积开销,商用DRAM通过称为位线的导线将许多DRAM单元连接到每个感应放大器。这些位线由于其较长的长度而具有较高的寄生电容,而该位线电容是DRAM延迟的主要来源。专用的低延迟DRAM使用较短的位线和较少的单元,但是由于更大的感测放大器面积开销而具有较高的每位成本。在这项工作中,我们介绍了分层延迟DRAM(TL-DRAM),它既实现了低延迟又实现了较低的每位成本。在TL-DRAM中,每条长位线被隔离晶体管分成两个较短的段,从而允许以短位线DRAM的等待时间访问一个段,而不会产生较高的每位成本。我们提出了将低延迟段用作硬件管理或软件管理缓存的机制。评估表明,我们提出的机制可提高单核和多程序工作负载的性能和能效。

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