A Modified MEMS-Casting Based TSV Filling Method with Universal Nozzle Piece That Uses Surface Trenches as Nozzles

摘要

Through-Silicon Via(TSV) is an ever-important interconnection technology for advanced packaging. Via-filling is the most critical and costly process in the whole TSV fabrication. In this paper, we present a modified MEMS-casting TSV filling method that uses a nozzle piece, on which surface KOH etched trenches are employed as nozzles. By this improved method, a universal nozzle can be used for TSV arrays with different diameters. TSV arrays with diameters from 20μm to 300μm have been demonstrated.