Diamond wire cutting (fixed abrasive wire cutting) is an economically promising alternative technology for slurry-based loose abrasive wire cutting in the field of slicing of hard crystalline materials, especially for photovoltaic Si-wafers. Main function-related characteristics for a practical application in wafer manufacturing are both cutting performance and wear resistance. The achieved procedure and the experimental setup permit the testing of the diamond cutting wires under conditions comparable to the real slicing process, but with drastically reduced consumption of work material and diamond cutting wire.
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