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A New Self-Aligned NAND Type SONOS Flash Memory with High Scaling Abilities, Fast Programming/Erase Speeds and Good Data Retention Performances

机译:一种新的自对齐NAND型SONOS闪存,具有高扩展能力,快速编程/擦除速度和良好的数据保留性能

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In this paper, we will propose a new NAND type SONOS cell structure with high efficiency Source Side Injection programming and F-N erase. This cell is characterized in high scaling abilities, fast program/erase speeds and very satisfactory data retention performances. In consideration of the threshold voltage saturation of the SONOS cell during erase, we use the modified erase bias configuration, DSPE (Decrement Step Pulse Erase), to speed up the erase operation and enlarge the memory window without adding any process complexities. To further improve the erase speed, p+-poly gate has firstly been utilized on our NAND type SONOS cell. From our experimental results, p+-poly gate not only prolongs erase threshold voltage saturation to the longer time but improves charge loss characteristics. Instead of traditional threshold voltage extrapolations from short to long time, we applied the time constant model to predict concrete threshold voltage values with various baking time and temperatures.
机译:在本文中,我们将提出具有高效率源侧注射编程和F-N擦除的新NAND型SONOS细胞结构。该单元的特征在于高分化能力,快速节目/擦除速度以及非常令人满意的数据保留性能。考虑到擦除期间SONOS单元的阈值电压饱和度,我们使用修改的擦除偏置配置,DSPE(减量步长脉冲擦除),加速擦除操作并放大内存窗口而不添加任何过程复杂性。为了进一步提高擦除速度,首先在我们的NAND型SONOS细胞上使用P + -Poly GATE。从我们的实验结果来看,P + -Poly Gate不仅延长擦除阈值电压饱和度,而且提高了电荷损耗特性。从短到长时间的传统阈值电压外推外,我们应用了时间常数模型,以预测各种烘烤时间和温度的具体阈值电压值。

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